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Home > Diamond Laser Equipment
CVD Wafer Stealth Dicing Machine
CVD Wafer Stealth Dicing Machine CVD Wafer Stealth Dicing Machine CVD Wafer Stealth Dicing Machine CVD Wafer Stealth Dicing Machine

CVD Wafer Stealth Dicing Machine

Item No.: SY-DS22A
This new model is for slicing large size CVD / SiC wafers, which solve the problem of materials loss, thermal and stress damage during processing with old methods and achieve zero edge chipping.
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Description
This new model is for slicing large size CVD / SiC wafers efficiently, which solve the problem of materials loss, thermal and stress damage during processing with old methods and achieve zero edge chipping. 
It provide preparation capabilities of core material such as diamond substrates for next-generation high-frequency and high-power electronic devices, NV centers chips for quantum sensing, and heat sinks for high-power lasers.

CVD Wafer Stealth Dicing Machine 

Stealth Dicing samples
 
  1. Very small kerf loss (100mic) , this keef loss will not increase with size increasing.
  2. No thermal effect on peeling surface, yield rate achieve 99.9% (Ra 4mic, TTV ≤20mic)
  3. Dicing irregular shaped material or materials with warpage surface high precisely